High Vacuum Magnetron Sputtering Deposition PVD System For Multilayer & Multitarget

High Vacuum Magnetron Sputtering Deposition PVD System For Multilayer & Multitarget

Model: TMAX-PC-JS07-High Vacuum & Multilayer & Multitarget

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Key Features & Applications

The TMAX-PC-JS07 is designed for nano-scale single-layer and multilayer functional films, including hard coatings, metallic films, semiconductor layers, and dielectric films. Ideal for research institutions and universities, it supports both material science studies and small-batch production.

System Components

· Vacuum chamber system (sputtering chamber)

· Target & power supply system

· Sample stage system

· Vacuum pumping & measurement system

· Gas flow system

· Control system

· Film thickness monitoring system

· Top cover lifting mechanism

· Electrical control system

· Computer-controlled system & auxiliary components

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Technical Specifications

Parameter	Value
Ultimate Vacuum	6.7×10-5 Pa
System Leak Rate	1×10-7 Pa·L/S
Vacuum Recovery Time	≤40 min to 6.6×10 Pa (after N2 purge)
Chamber Design	Round chamber, Ø450×350 mm
Sample Stage	3-inch × 3-inch (3.2 mm thick)
Heating Temperature	600°C ±1°C (programmable)
Sample Rotation	Self-rotation: 0–50 RPM (uniformity)  Revolution: Position-switching capability
Magnetron Target	3 targets (standard)  Effective Sputtering Area: 3-inch × 3-inch  Type: Permanent magnet, brazed indirect water-cooled
Deposition Mode	Upward sputtering (planar target)
Substrate Bias Voltage	Up to –200 V
Gas Flow System	2-channel mass flow controller
Thickness Monitor	Quartz crystal sensor (0–999,999 Å)
Pumping Options	Turbo molecular pump / Cryogenic pump + Dry scroll pump

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Control & Automation

· Real-time monitoring: Tracks displacement and revolution speed.

· Error analysis: Displays deviations via curves/numerical data.

· Flexible display: Switch between linear and logarithmic scales for revolution speed vs. displacement.

· Advanced modes: Supports fixed-point deposition and resistive evaporation coating.

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Why Choose?

✔ High Precision: Programmable heating (±1°C) and dual-axis sample motion ensure uniform film growth.
✔ Versatile Configurations: Compatible with multiple target materials and pumping systems.
✔ Research-Oriented: Combines in-situ thickness control with automated process logging for reproducible results.

Ideal for: Advanced material research, optical coatings, semiconductor layers, and protective coatings development.