Multi-target Composite Magnetron Sputtering Film Deposition Coating System

Multi-target Composite Magnetron Sputtering Film Deposition Coating System

Model: TMAX-PC-JS10-Multi-target, Multi-film Deposition

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Specifications

Category	Parameter
Primary Application	Nanoscale monolayer/multilayer films (hard coatings, metals, semiconductors, dielectrics)
Target Users	Universities, research institutes (R&D and small-batch production)
System Composition	Vacuum chamber, sputtering targets, sample stage, vacuum pumps, gas delivery, control systems, film thickness monitor, and auxiliary components

Vacuum Performance

Parameter	Specification
Ultimate Vacuum	6.7 × 10-5 Pa
System Leak Rate	≤1 × 10-7 Pa·L/s
Vacuum Recovery Time	≤40 min (to 6.6 × 10-1 Pa after N2 purge)

Chamber & Sample Stage

Component	Specification
Chamber Dimensions	Ø630 mm × 350 mm (cylindrical)
Sample Capacity	8 × 4-inch substrates (1 mm thickness)

Sputtering Targets

Feature	Specification
Target Types	3 × Permanent magnet targets, 3 × High-intensity magnet targets
Cooling Method	Indirect water-cooled (brazed structure)
Target Diameter	Ø100 mm
Target-Substrate Distance	50–90 mm (manual adjustment, with position indicator)
Sputtering Mode	Vertical downward sputtering

Substrate Control

Parameter	Specification
Bias Voltage	Up to -200 V
Rotation Mechanism	Computer-controlled revolution + rotation (stepper motor-driven)
Temperature Control	RT to 300°C (single calibration required; 3 heaters, one active at a time)

Gas & Thickness Control

Component	Specification
Mass Flow Controllers (MFC)	2 channels
Film Thickness Monitor	Quartz crystal microbalance (0–999,999 Å)

Pumping Options

Configuration	Components
Standard	Turbo molecular pump + dry scroll pump
Alternative	Cryogenic pump + dry scroll pump

Computer Control Features

· Real-time displacement/speed monitoring with error calculation.

· Linear/logarithmic display modes for speed vs. displacement.

· Site-specific deposition via precision positioning.

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Key Advantages & Applications

✔ Multi-Target Flexibility – Supports diverse materials (metals, oxides, nitrides).
✔ Uniform Deposition – Computer-controlled rotation ensures film consistency.
✔ High Vacuum Stability – Minimizes contamination for high-purity films.
✔ Research-Ready – Modular design suits optoelectronics, tribological coatings, and semiconductor R&D.

Ideal for: Advanced material science studies and prototyping of functional thin-film devices.