Multi-Target PVD Magnetron Sputtering Coating Machine Equipment System For CompositeThin Film Deposition

Multi-Target PVD Magnetron Sputtering Coating Machine Equipment System For CompositeThin Film Deposition

Model: TMAX-TK-JS03-Multilayer Thin Film Fabrication

Application Fields

Electronics/Batteries, Steel/Metals, Aerospace, Automotive & Components, Electrical Industries

---

Product Features & Applications

► Dual-functionality: Supports both sputtering and evaporation processes. Compact footprint, cost-effective, stable performance, and low maintenance.
► Versatile coating capabilities: Deposits single/multi-layer films including metal films (Ag, Al, Cu, Ni, Cr, NiCr alloys), dielectric films (TiO₂, SiO₂), semiconductor films (ITO), magnetic films, heat-resistant alloys, and corrosion-resistant/ hard coatings.
► Flexible configurations: Single-target, sequential multi-target, or co-sputtering modes for multilayer/composite films.

---

Technical Specifications

Parameter	Specification
Model	TMAX-TK-JS03
Chamber Structure	Vertical top-opening, rear-mounted pumping system, pneumatic lift
Chamber Dimensions	Φ350 × H350 mm
Heating Temperature	Room temp. ~ 500°C
Sputtering Mode	Upward sputtering
Substrate Stage	Rotating, Φ120 mm
Film Uniformity	≤±5.0% (Φ75 mm area)
Targets	2× Φ2" magnetron targets (DC/RF compatible)
Gas Control	2–3 channels MFC
Control System	PLC + touchscreen (semi-automatic)
Footprint (Main Unit)	L1600 × W800 × H1920 mm
Power Consumption	≥8 kW

---

Key Performance Metrics

1. Vacuum System:

·Pumps: Compound molecular pump + rotary vane pump, with electric/gas valves.

·Base Pressure: ≤6.6×10⁻⁵ Pa (after 24h pumping).

·Leak Rate: ≤0.8 Pa/h.

·Pump-down Time: ≤15 min (to 5.0×10⁻³ Pa, empty chamber).

2. Substrate Handling:

·Rotation: 0–20 rpm.

·Heating: RT ~ 500±1°C.

3. Target Configuration:

·3× Φ2" magnetron targets (coaxial sputtering).

·Includes DC (2 units) + RF (1 unit) power supplies, with pneumatic shutters.

4. Safety & Control:

·Protections: Overcurrent/voltage, water cooling faults, and interlock system.

·Noise Level: ≤70 dB.

---

Unique Advantages & Target Users

· Research & Production Flexibility: Ideal for nano-scale conductive/magnetic films (Ni, Co), semiconductor layers (ITO, ZnO), and ceramic insulating films.

· Multi-target Synergy: Independent/sequential/co-sputtering modes enable complex multilayer structures.

· User-Friendly: PLC+touchscreen control suits academic labs, R&D centers, and industrial production.

Ideal For: Universities, research institutes, and manufacturers requiring high-precision, repeatable thin-film deposition for advanced materials.