Lab Desktop Metal Magnetron Sputtering Coating Machine System For Thin-Film Fabrication

Lab Desktop Magnetron Sputtering Coating Machine System For Thin-Film Fabrication

Model: TMAX-PC-JS04-Multilayer Thin-Film Fabrication

Technical Specifications

Parameter	Specification
Base Vacuum	6.7×10−5 Pa
Operating Vacuum (after 1h)	≤4×10−4 Pa
Magnetron Targets	3 (3-inch, permanent magnet, water-cooled, side shutters)
Target-to-Substrate Distance	120–200 mm (manually adjustable, scale-indicated)
Target Tilt Angle	0–45°
Substrate Heating	Iodine-tungsten lamp, max 400°C
Substrate Size	Φ60 mm (single-piece)
Substrate Rotation	0–50 RPM (motorized)
Bias Voltage	0–200 V (adjustable)
Gas Flow Control	2-channel MFC, 0–50 sccm range
Control Functions	Manual heating/rotation/shutter/vacuum monitoring

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Key Features & Applications

1. Precision & Flexibility

· Adjustable target-substrate geometry for tailored film stress and uniformity.

· Three-target co-sputtering enables multilayer/composite films (e.g., superlattices).

2. High-Quality Deposition

· UHV-compatible chamber minimizes impurities for high-purity films.

· Heated substrate (400°C max) improves crystallinity (e.g., for oxides/semiconductors).

3. Compact Research Tool

· Benchtop design suits small-batch R&D and material screening.

Typical Uses

· Protective coatings (e.g., TiN, DLC for tools).

· Transparent conductive films (e.g., ITO, AZO).

· MEMS/sensor fabrication.

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Best for: Labs requiring flexible, high-precision thin-film deposition with manual control.