Small High-Vacuum Dual-Target Magnetron Ion Sputtering Coating System Coater

Small High-Vacuum Dual-Target Magnetron Ion Sputtering Coating System Coater

Model: TMAX-HZ-JS04- High-Vacuum Dual-Target Sputtering Coater

Technical Parameters

Category	Specification
Model	TMAX-HZ-JS04
Vacuum System	Oil-free diaphragm pump + molecular pump
Ultimate Vacuum	≤1.0×10⁻⁴ Pa
Pressure Measurement	Full-range cold cathode gauge + front-end Pirani gauge
Gas Control	MFC (Mass Flow Controller) for Ar/O₂/N₂
Target Configuration	Dual targets (independent control, alternate/synchronous sputtering)
Target Compatibility	Metals, alloys, compounds (custom sizes available)
Optional Feature	Real-time thickness monitoring (nanometer precision)
Cooling System	Energy-efficient target cooling
Safety Protections	Overpressure/overcurrent/overheat protection, vacuum interlock, emergency vent

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Key Features

1. Dual-Target Flexibility

·Enables multi-material deposition (e.g., bilayers, graded films, or interfaces) in a single run.

2. High-Vacuum Precision

·Ultra-low base pressure (≤1.0×10⁻⁴ Pa) minimizes contamination for high-purity films.

3. Intelligent Process Control

·MFC-regulated gas flow ensures repeatable reactive sputtering (e.g., oxides/nitrides).

4. User-Optimized Design

·Energy-saving pumps and cooling reduce operational costs without compromising performance.

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Typical Applications

· Semiconductors: Electrode/metallization layers, barrier films.

· Optics: Anti-reflective, conductive, or hard coatings.

· Energy: Thin-film batteries, solar cell layers.

· Research: Nanomaterials, heterostructures, surface engineering.

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Why Choose?

· Lab to Production: Scalable for both R&D prototyping and industrial batch processing.

· Safety & Reliability: Automated safeguards protect equipment and users.

· Customizable: Adaptable to diverse materials and film architectures.