Versatile High Vacuum Magnetron Sputtering Metal Equipment System With Multi-target For Films Deposition

Versatile High Vacuum Magnetron Sputtering System With Multi-target For Compound Multilayer Films Deposition

Model:  TMAX-PD-JS03-Multi-target For Multilayer Films Deposition

Product Overview

The TMAX-PD-JS03 magnetron sputtering system is designed for scientific research institutions and university laboratories. Featuring core components system offers stable performance, high automation, and serves as a competitive alternative to imported equipment.

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Key Features

1. Versatile Sputtering Modes

·Compatible with both DC and RF sputtering sources, enabling deposition of metallic, non-metallic, and compound thin films.

·Supports multi-layer and composite film deposition for advanced material research.

2. Superior Film Quality

·Delivers excellent uniformity (±3%~5%) and repeatability for metals, semiconductors, and insulating materials.

3. Optimized Configuration

·Equipped with three 3-inch circular target guns, mounted in a co-focal upward sputtering arrangement.

·Adjustable sputtering area: 2–4 inches (compatible with 2–3 inch targets).

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Technical Specifications

Parameter	Value / Description
System Dimensions (L×W×H)	850 × 1100 × 1900 mm
Chamber Dimensions (L×W×H)	400 × 400 × 380 mm
Substrate Stage	Max temperature: 600°C (±5°C accuracy)
Ultimate Vacuum	≤ 5 × 10−5 Pa
Pump-down & Holding	≤ 8 × 10−4 Pa in 30 min; ≤ 8 Pa over 12 hours
Uniformity	Better than ±3%–5%
Target Configuration	3 guns (2–3 inch), 2–4 inch deposition area

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Application Scope

The PD-400C is ideal for depositing nitrides, oxides, and other functional films, catering to:

· Semiconductor research (e.g., conductive/dielectric layers).

· Optical coatings (anti-reflective, protective films).

· Advanced materials (multilayer structures, composite films).

Installation Notes

1. Leveling: Ensure absolute horizontal alignment using a spirit level to guarantee film uniformity.

2. Connections: Securely attach power, cooling water, and vacuum pipelines, checking all seals for leaks.

3. Inspection: Verify no physical damage occurred during transit.

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Working Principle

The system utilizes glow discharge of inert gases to generate ionized particles. These particles bombard the target surface, ejecting atoms/molecules that condense on the substrate to form thin films. Secondary electrons sustain plasma, enhancing deposition efficiency.

Why Choose?

· Reliability: Premium components ensure long-term stability.

· Flexibility: Dual-mode sputtering for diverse materials.

· Precision: Tight temperature/vacuum control for reproducible results.